Origin Code to Showcase the Flagship VORTEX DDR5 at CES 2026
Origin Code, the emerging force in high-end PC hardware, announces the debut at CES 2026 of its flagship memory series, VORTEX DDR5.
Engineered for enthusiasts who demand sustained performance, VORTEX is the world’s first DDR5 module to feature a detachable triple-fan active cooling system, pushing the boundaries of overclocking stability and low-latency responsiveness.
Visitors can witness the future of performance memory firsthand at The Venetian Expo, Level 1, Suite Galileo 1004, from January 6th to 9th.
Engineered Beyond Limits: Performance as a Constant
Unlike traditional memory that chases short-term benchmark peaks, VORTEX is designed for sustained high-frequency operation under heavy thermal loads. By combining premium ICs, a low-loss PCB architecture, and precise timing control, VORTEX ensures stability during extended gaming sessions, content creation, rendering, and AI-driven workloads.
While optimized primarily for AMD platforms with tuned EXPO profiles, the series offers versatile configurations ranging from ultra-low latency kits to high-density capacity options.
VORTEX Launch Configurations:
Speed & Latency Focus: 6200 MT/s CL26 | 32 GB (2x 16 GB)
Dual-Profile Performance: 6000 MT/s CL26 (Base) / 8000 MT/s CL36 (Profile 2) | 48 GB (2x 24 GB)
High Capacity: 6000 MT/s CL26 | 192 GB (4x 48 GB)
Max Density: 6000 MT/s CL30 | 256 GB (4x 64 GB)
1DPC Specialist: 6000 MT/s CL26 (Base) / 8000 MT/s CL36 (Profile 2 - 1DPC) | 96 GB (2x 48 GB)
Thermal Innovation: The Triple-Fan Advantage
To maintain stability at aggressive timings, VORTEX introduces a modular active cooling solution.
Active Cooling: A detachable unit housing three 4020 (40x40x20mm) dual-ball bearing fans delivering 22.5 CFM of airflow.
Precision Control: Fully adjustable PWM control ranging from 800 to 8000 RPM.
Patented ScaleCut™ Architecture: The aluminum heatsink features 0.75mm double-beveled recesses. This patented geometry maximizes surface area and optimizes airflow channels.
When paired with the active fan module, the system achieves up to 39.8% higher heat dissipation efficiency compared to passive solutions, eliminating thermal throttling during overclocking. Importantly, the fan assembly is mechanically independent and optional; every VORTEX module is rated to run at its guaranteed EXPO speeds passively, giving users flexibility for different build sizes.
Validation and Availability
VORTEX DDR5 has been validated across major motherboard platforms, including ASUS, MSI, and Gigabyte, to ensure broad compatibility. The modules feature a premium aluminum alloy aesthetic accented by dynamic RGB lighting.
FOR IMMEDIATE RELEASE
Origin Code to Showcase the Flagship VORTEX DDR5 at CES 2026
Advancing Overclocking Beyond Conventional DDR5 Limits with Tighter Timings
and Precision Cooling
Las Vegas, NV, January 6, 2026 - Origin Code, the emerging force in high-end PC hardware, announces the debut at CES 2026 of its flagship memory series, VORTEX DDR5.
Engineered for enthusiasts who demand sustained performance, VORTEX is the world’s first DDR5 module to feature a detachable triple-fan active cooling system, pushing the boundaries of overclocking stability and low-latency responsiveness.
Visitors can witness the future of performance memory firsthand at The Venetian Expo, Level 1, Suite Galileo 1004, from January 6th to 9th.
Engineered Beyond Limits: Performance as a Constant
Unlike traditional memory that chases short-term benchmark peaks, VORTEX is designed for sustained high-frequency operation under heavy thermal loads. By combining premium ICs, a low-loss PCB architecture, and precise timing control, VORTEX ensures stability during extended gaming sessions, content creation, rendering, and AI-driven workloads.
While optimized primarily for AMD platforms with tuned EXPO profiles, the series offers versatile configurations ranging from ultra-low latency kits to high-density capacity options.
VORTEX Launch Configurations:
Speed & Latency Focus: 6200 MT/s CL26 | 32 GB (2x 16 GB)
Dual-Profile Performance: 6000 MT/s CL26 (Base) / 8000 MT/s CL36 (Profile 2) | 48 GB (2x 24 GB)
High Capacity: 6000 MT/s CL26 | 192 GB (4x 48 GB)
Max Density: 6000 MT/s CL30 | 256 GB (4x 64 GB)
1DPC Specialist: 6000 MT/s CL26 (Base) / 8000 MT/s CL36 (Profile 2 - 1DPC) | 96 GB (2x 48 GB)
Thermal Innovation: The Triple-Fan Advantage
To maintain stability at aggressive timings, VORTEX introduces a modular active cooling solution.
Active Cooling: A detachable unit housing three 4020 (40x40x20mm) dual-ball bearing fans delivering 22.5 CFM of airflow.
Precision Control: Fully adjustable PWM control ranging from 800 to 8000 RPM.
Patented ScaleCut™ Architecture: The aluminum heatsink features 0.75mm double-beveled recesses. This patented geometry maximizes surface area and optimizes airflow channels.
When paired with the active fan module, the system achieves up to 39.8% higher heat dissipation efficiency compared to passive solutions, eliminating thermal throttling during overclocking. Importantly, the fan assembly is mechanically independent and optional; every VORTEX module is rated to run at its guaranteed EXPO speeds passively, giving users flexibility for different build sizes.
Validation and Availability
VORTEX DDR5 has been validated across major motherboard platforms, including ASUS, MSI, and Gigabyte, to ensure broad compatibility. The modules feature a premium aluminum alloy aesthetic accented by dynamic RGB lighting.
Experience VORTEX and Origin Code at CES 2026
Origin Code invites media, partners, and enthusiasts to experience VORTEX:
Location: Venetian Expo, Las Vegas, NV
Booth: Galileo 1004, Level 1
Dates: January 6-9, 2026
Live Demos Include:
Sustained Overclocking: Real-world workload benchmarks demonstrating stability over time.
Thermal Engineering: A breakdown of the ScaleCut™ active vs. passive cooling performance.
Hands-On Builds: Full PC systems configured with VORTEX DDR5.